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Modular processes - Large packaging variety - Proven IP |
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The technologies available possess geometries ranging from 1µm – 0,18 µm. They are modular in design and equipped with a basic module which can be complemented by the following options: „high voltage“, „EEPROM / FLASH“ or „OPTO“. Depending on the number of units per year projected by you, we choose the most appropriate technology. Economically reasonable numbers of units commence for digital designs around 5000 units per year and around 25.000 units per year for mixed analogue digital designs. We also offer smaller quantities - requiring however an extra charge for odd lots.
IC-Packages It is generally possible to place your IC into almost all types of packages, which can be selected out of a huge package selection. Amongst them we offer MLPQ, QFN, QFP, SO and DIL packages. Do you have a special packaging requirement ? Please feel free to contact us.
IP-library As a result of our numerous implementations, we have a wide-range analogue as well as digital IP on hand. This allows us to minimize design risks as well as accurately predict development time. Our IP-library includes a huge contingency of OPAmps, comparators, compensated BIAS cells, AD and DA-converters, power supply units, ESD structures and much more.
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